• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
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    • 专利摘要:
    In one aspect, conduction cooled modules are described herein. In some implementations, a conduction-cooled module includes first and second outer support structures (110, 120) arranged facing each other opposite to one another, forming a component shell (170). ) between them. In some implementations, the modules are configured to contact at least one cold plate (140) and to retain at least one printed circuit board (130) in the component shell (170) between the first structure external support (110) and the second external support structure (120).
    公开号:FR3020741A1
    申请号:FR1551905
    申请日:2015-03-06
    公开日:2015-11-06
    发明作者:Charles E Kusuda；Jeffrey W Glasnovich；Erik L Godo；Roy D Nye；Namsoo P Kim
    申请人:Boeing Co；
    IPC主号:
    专利说明:

    [0001] The present invention relates to the conditioning of an electrical and / or electronic circuitry and, in particular, to form factors for the thermal management and / or conditioning of an electrical and / or electronic circuitry on circuit boards. circuits.
    [0002] When used in electronic applications, such as electronic devices designed for use in aeronautics, or other applications, circuit boards are generally provided with a package that provides structural support and / or thermal management of the circuit boards and the corresponding electronic circuitry. The commonly used form factors for conditioning and thermal management of electronic circuitry result in large, heavy, and thermally limited in-line replaceable unit designs. There is therefore a need for improved form factors or improved modules of reduced volume, lower weight and / or improved thermal management.
    [0003] In one aspect, conductive cooled modules are described herein which, in some embodiments, may have one or more advantages over prior modules. For example, in some cases, conduction cooled modules described herein may have reduced volume, lower weight, and / or improved thermal management over other form factors or modules. In addition, in some examples, conduction-cooled modules described herein may house electronic functionalities commonly used in aeronautics or other applications in a reduced volume, with lower weight and / or improved thermal management. Therefore, in some implementations, a conduction cooled module described herein may allow the installation of a new electronic system function, such as a system function made available in a required volume suitable for existing electrical furniture, without require additional equipment installation volumes. In addition, in some implementations, a conduction cooled module described herein may have a structure allowing for reduced equipment installation times. In addition, in some implementations, a conduction cooled module described herein may result in reduced weight for electrical and / or electronic systems, increasing the payload capacity in aeronautics or similar applications. In addition, in some implementations, a conduction cooled module described herein contains electromagnetic emissions within the module and / or attenuates electromagnetic interference. As will be described hereinafter, one or more of the above-mentioned advantages can be provided by conduction-cooled modules having a certain external support structure, a certain component envelope and other architectures described herein. In some implementations, a conduction cooled module described herein includes first and second outer support structures facing away from each other. In some implementations, a component envelope is defined by the first and second external support structures and is located between the first and second external support structures. In some implementations, the conduction cooled module is an on-line replaceable unit. In addition, in some implementations, the first and second external support structures are configured to contact at least one cold plate and to retain at least one printed circuit board in the component shell between the first and second external support structures. In some implementations, the first and second support structures constitute a continuous path, and in some implementations, a main heat conduction path between the printed circuit board and the cold plate. In some implementations, the first and / or second external support structures comprise one or more heat exchanger surfaces extending into the component shell.
    [0004] In some implementations, a conduction cooled module described herein comprises a thermally conductive substrate disposed between the first and second external support structures, the substrate being configured to contact the at least one printed circuit board. Further, in some implementations, the substrate is configured to contact a first printed circuit board on a first side of the substrate and with a second printed circuit board on a second side of the substrate facing the opposite side. at the first side of the substrate. Further, in some implementations, at least one printed circuit board comprises one or more electronic components extending in the component envelope adjacent the surface of the printed circuit board, preferably above the surface. of the printed circuit board. In addition, in some implementations, the at least one printed circuit board divides the component envelope into a first component envelope portion and a second component envelope portion. In some implementations, the first and second envelope portions have substantially equal heights. In some implementations, the first and second envelope portions have substantially different heights. In one embodiment, the component shell has a height between about 0.2 inches and about 1.5 inches. In addition, in some implementations, the first external support structure and / or the second external support structure comprise one or more heat exchanger surfaces extending into the component envelope. In some implementations, the first external support structure and / or the second external support structure comprise or are formed of a composite material comprising graphene particles dispersed in a matrix material. In alternative implementations, the first external support structure and / or the second external support structure comprise or are formed of aluminum, aluminum alloys, copper, copper alloys, titanium, alloys of titanium, stainless steel or combinations thereof. In other embodiments, a conduction cooled module described herein further comprises a connector shell engaging the first and second outer support structures at one end of the first and second external support structures. In some implementations, a conduction cooled module described herein may be an on-line replaceable unit. In addition, in some implementations, the at least one cold plate of a conduction cooled module described herein may be a portion of a rack. In some implementations, a cold plate is a part of a shelf, and the shelf is also a part of a rack. In some cases, the first external support structure and the second external support structure are configured to contact the at least one cold plate with a wedge, fork or clamp interface. In another aspect, conductive cooling racks are described herein which, in some embodiments, may have one or more advantages over known conduction cooling racks. In some cases, for example, a conduction cooling rack described herein may be used to house one or more conduction cooled modules. In some implementations described herein, a conduction cooling rack includes first and second cold plate surfaces separated from each other and facing each other opposite from each other. In some implementations, the first and second cold plate surfaces define an interior rack volume. In addition, in some implementations, one or more conduction-cooled modules are disposed in the rack interior volume between the first and second cold plate surfaces in physical contact with the first and second cold plate surfaces. In addition, in some implementations, at least one of the conduction cooled modules disposed in the rack interior volume includes first and second support structures facing away from each other. Thus, in some implementations, a component envelope is defined by the first and second external support structures and is located between the first and second external support structures. In some implementations, the first and second outer support structures are configured to contact the first and second cold plate surfaces and to retain at least one printed circuit board in the component shell between the first and second cold plate surfaces. second external support structures. According to one aspect of the present invention, there is provided a conduction cooled module comprising: a first external support structure; a second outer support structure facing away from the first outer support structure; and a component envelope defined by the first external support structure and the second external support structure and located between the first external support structure and the second external support structure, wherein the first external support structure and the second support structure. External support is configured to contact at least one cold plate and to retain at least one printed circuit board in the component shell between the first external support structure and the second external support structure.
    [0005] Advantageously, the first and second external support structures form continuous heat conduction paths between the printed circuit board and the cold plate. Advantageously, the first and second external support structures form the main heat conduction paths between the printed circuit board and the cold plate. Advantageously, the printed circuit board is an ARINC 600 printed circuit board. Advantageously, the module further comprises a thermally conductive substrate disposed between the first external support structure and the second external support structure, the substrate being configured to contact the at least one printed circuit board. Advantageously, the substrate is configured to contact a first printed circuit board on a first side of the substrate and a second printed circuit board on a second side of the substrate facing away from the first side of the substrate. . Advantageously, the at least one printed circuit board comprises one or more electronic components extending into the component envelope above the surface of the printed circuit board. Advantageously, the component shell has a height of between about 0.2 inches and about 1.5 inches. Advantageously, the at least one printed circuit board divides the component envelope into a first component envelope portion and a second component envelope portion, the first and second component envelope portions being of substantially equal heights. Advantageously, the at least one printed circuit board divides the component envelope into a first component envelope portion and a second component envelope portion, the first and second component envelope portions being of significantly different heights. Advantageously, the first external support structure and / or the second external support structure comprise one or more heat exchange surfaces extending in the component envelope.
    [0006] Advantageously, the first external support structure and / or the second external support structure consist of a composite material comprising graphene particles dispersed in a matrix material. Advantageously, the first external support structure and / or the second external support structure comprise a material selected from the group consisting of aluminum, aluminum alloy, copper, copper alloy, titanium, titanium alloy, stainless steel and combinations thereof. Advantageously, the module further comprises a connector casing engaging the first external support structure and the second external support structure at one end of the first and second external support structures. Advantageously, the conduction cooled module is an on-line replaceable unit. Advantageously, the at least one cold plate is a portion of a rack. Advantageously, the first external support structure and the second external support structure are configured to be in contact with at least one cold plate in a configuration selected from the group consisting of a corner housing interface, a fork interface and a clamping interface. According to another aspect of the present invention, there is provided a conduction cooling rack comprising: a first cold plate surface; a second cold plate surface separated from the first cold plate surface and facing away from it to define an interior rack volume; and one or more conduction-cooled modules disposed in the inner rack volume between the first cold plate surface and the second cold plate surface and in physical contact with the first cold plate surface and the second cold plate surface, at least one of the conduction cooled modules comprising a first external support structure; a second external support structure facing away from the first external support structure; and a component envelope defined by the first external support structure and the second external support structure and located between the first external support structure and the second external support structure, wherein the first external support structure and the second support structure. external support is configured to contact the first cold plate surface and the second cold plate surface and retain at least one printed circuit board in the component shell between the first external support structure and the second support structure external. Advantageously, the first outer support structure, the second outer support structure or both are made of a composite material comprising graphene particles dispersed in a matrix material. Advantageously, the first external support structure, the second external support structure or both comprise a material selected from the group consisting of aluminum, aluminum alloy, copper, copper alloy, titanium, titanium alloy, stainless steel and combinations thereof. These implementations and other implementations will be described in detail below with reference to the accompanying drawings, in which: FIG. 1 illustrates a front view in cross section of a conduction cooled module according to an implementation described. right here ; FIG. 2 illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; Figure 3 illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; Fig. 4A illustrates a cross-sectional side view of a conduction cooled module according to an implementation described herein; FIG. 4B illustrates a cross-sectional top view of a conduction cooled module according to an implementation described herein; FIG. 4C illustrates a front view in cross section of a conduction cooled module according to an implementation described herein; Fig. 5A illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; Fig. 5B illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; FIG. 5C illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; Figure 5D illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; FIG. 6 illustrates a front view in cross section of a conduction cooled module according to an implementation described herein; Fig. 7 illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; Fig. 8A illustrates a cross-sectional front view of a conduction-cooled module according to an implementation described herein; Fig. 8B illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; FIG. 8C illustrates a cross-sectional front view of a conduction cooled module according to an implementation described herein; Figure 9 illustrates a conduction cooling rack according to an implementation described herein. Implementations described herein may be more readily understood by reference to the following detailed description, examples, and drawings. The elements, apparatus, and methods described herein are not limited to the specific implementations set forth in the detailed description, examples, and drawings. It should be appreciated that these implementations are merely illustrative of the principles of the present invention. In addition, the dimensions provided for specific examples or drawings herein are not intended to limit additional or alternative implementations of the elements, apparatus, and methods described herein. Many modifications and adaptations will be immediately apparent to those skilled in the art without departing from the spirit and scope of the invention. In addition, all ranges disclosed herein should be understood to encompass all sub-ranges integral with them. For example, a range of "1.0 to 10.0" should be considered to include all sub-ranges beginning with a minimum value of 1.0 or greater and ending with a maximum value of 10.0 or minus, for example 1.0 to 5.3 or 4.7 to 10.0 or 3.6 to 7.9.
    [0007] All ranges disclosed here should also be considered to include the endpoints of the beach unless otherwise indicated. For example, a range "between 5 and 10" should be generally considered to include endpoints 5 and 10.
    [0008] In addition, when the term "up" is used in relation to a volume or quantity, it should be understood that it is at least a detectable volume or quantity. For example, a material present in a volume "up to" a specified volume may be present from a detectable volume and up to the specified volume included.
    [0009] I. Conducted Cooled Module In one aspect, conduction cooled modules are described herein. In some implementations, a conduction-cooled module includes first and second external support structures, the second external support structure facing away from the first external support structure. As used herein, the term "oppositely facing" means that each of the first and second external support structures comprises first and second sides, the first side of a support structure being configured to face a first side of the other support structure. In some implementations, the conduction-cooled module further comprises a component envelope defined by the first and second external support structures, and is located between the first and second external support structures. In addition, in some implementations, the first and second external support structures are configured to contact at least one cold plate and to retain at least one printed circuit board (PWB) in the component envelope between them. first and second support structures. In some implementations, a conduction cooled module described herein may be an on-line replaceable unit (LRU). As used herein, the term "LRU" refers to an element or component that can be quickly installed or replaced at an operating location. In addition, an LRU can be replaced in the field, for example, in the event of a failure, so that the whole or the overall structure including the LRU can operate with a replacement LRU while the main LRU is undergoing repairs without having to put the assembly containing the LRU out of order in order to repair a single component. In some implementations, a conduction cooled module, as described herein, may be a component of a larger assembly or may include or interface with a cold plate that is, for example, a component of the larger set or conduction cooled rack, etc. Materials in accordance with the objects of the present invention may be used. In some implementations, for example, the first external support structure and / or the second external support structure comprise or are formed of aluminum, aluminum alloys, copper, copper alloys, titanium , titanium alloys, stainless steel, brass or combinations thereof. In addition, in some implementations, the first outer support structure and / or the second outer support structure comprise or are formed of a composite material comprising graphene particles dispersed in a matrix material. In some cases, the matrix is thermally conductive. In addition, a matrix may comprise or be formed of a material in accordance with the objects of the present invention. For example, in some cases, a matrix comprises or is formed of a metal. A metal according to the objectives of the present invention can be used. In some implementations, the matrix of a composite material described herein comprises a metal selected from the group consisting of aluminum, aluminum alloys, copper, copper alloys, titanium, alloys titanium, stainless steel, brass and combinations thereof. In some cases, a matrix comprises or is formed of a non-metallic material, such as a polymeric material. A polymeric material in accordance with the objects of the present invention may be used. In some cases, a polymeric material is selected from the group consisting of a thermosetting material and a thermoplastic material. In some implementations, a matrix comprises or is formed of a polycarbonate, a polyethylene such as a high density polyethylene, a polypropylene, a polyvinyl chloride (PVC), an acrylonitrile butadiene styrene polymer (ABS), a maleimide or a bismaleimide, a phenol formaldehyde polymer, a polyepoxide, a polyether ether ketone (PEEK) polymer, a polyetherimide (PEI), a polyimide, a polysulfone or a combination of one or more of the above. It should be understood that, in the context of the present invention, when high thermal conductivity is desired, the conductivity of polymeric or other materials having low thermal conductivity is improved by an embedded conductive material such as, for example, materials containing thermally conductive graphite (such as, for example, pyrolytic graphite) or graphene. In addition, in some cases, the matrix of a composite material described herein comprises or is formed of one or more glasses, ceramics, or other refractory materials and carbon. A matrix may also comprise or be formed of a combination of a metal, a polymeric material, a glass material, a ceramic material and a carbon material. In addition, graphene particles in accordance with the objectives of the present invention can be used in a composite material described herein. According to the present invention, an exemplary graphene particle is a planar sheet having the thickness of a sp2 bonded carbon atom that is densely packed in a honeycomb crystal lattice. Graphene particles of a composite material described herein may be of any size and any form consistent with the objects of the present invention. In some cases, for example, graphene particles have an anisotropic shape, such as a rod or needle shape or a wafer shape. In some implementations, graphene particles include platelets, nanosheets, or graphene nanopellets formed of one or more atomic layers of graphene. Thus, in some implementations, a graphene particle described herein comprises, comprises, or consists essentially of one or more graphene sheets. In some embodiments, a graphene sheet comprises a molecular or atomic layer having a flat planar structure. Any number of graphene sheets consistent with the objectives of the present invention can be used. In some implementations, a graphene particle comprises a plurality of graphene sheets. The plurality of graphene sheets, in some implementations, may be arranged in a stacks or random layouts configuration. In other implementations, a graphene particle comprises or consists of a single graphene sheet of random orientation. Therefore, in some implementations, a graphene particle described herein includes one or more atomic layers of graphene. In some implementations, a graphene particle comprises between 1 and 10 atomic layers of graphene. In some implementations, a graphene particle comprises between 1 and 5 atomic layers or between 1 and 3 atomic layers of graphene. In other cases, a graphene particle comprises between 1 and 1000 atomic layers, between 1 and 500 atomic layers of graphene, or between 1 and 100 atomic layers of graphene. In addition, in certain implementations comprising graphene platelets, the platelets have an average thickness up to about 1000 nm or up to about 100 nm. In some cases, graphene platelets have an average thickness of about 0, 3 nm at about 1 nm, about 1 nm to about 1000 nm, about 1 nm to about 100 nm, about 1 nm to about 10 nm, or about 300 nm to about 1000 nm. In addition, in some cases, such graphene platelets have an average length and / or an average width of up to about 1 μm, up to about 1 cm, or up to about 5 cm. In some cases, platelets of graphene or other graphene particles have an average length and / or an average width of between about 1 μm and about 5 cm, between about 1 μm and about 1 cm, between about 1 μm and about 500 μm. pm, between about 1 μm and about 100 μm, between about 1 μm and about 10 μm, between about 5 μm and about 1 cm, between about 5 μm and about 500 μm, between about 5 μm and about 100 μm, between about 10 μm. and about 1 cm, between about 10 μm and about 500 μm, between about 10 μm and about 100 μm, between about 50 μm and about 1 cm, between about 100 μm and about 1 cm, or between about 100 μm and about 500 μm. . In addition, in some embodiments, anisotropic graphene particles have a random orientation within the matrix of a composite material described herein. For example, in some cases, graphene is provided as a plurality of random orientation graphene platelets. A "random" orientation, in the context of the present, is in relation to the direction of a single axis of the anisotropic particles. In some implementations, for example, a random orientation comprises an orientation in which the Z axes of the particles are randomly oriented in the three-dimensional space, where the Z axis of a particle may correspond to the thickness of the particle, as opposed to the length or width of the particle. Thus, random orientation particles can be in contrast with oriented or aligned particles. Nevertheless, it is also possible that the graphene particles of a composite material described herein have aligned orientation within the matrix of the composite material. An aligned orientation of graphene particles, in some cases, can be achieved by using a shear force during extrusion of a mixture of the graphene particles and the matrix material to form the composite material. It is also possible to obtain an aligned orientation of graphene particles using a method described in US Pat. No. 8,263,843 to Kim et al. In addition, in some cases, the graphene particles are oriented to conduct heat towards the edges of the first external support structure and / or the second external support structure. Graphene particles described herein may be in a composite material in any amount in accordance with the objects of the present invention. In some cases, for example, the composite material comprises graphene particles in an amount of about 1% by volume to about 90% by volume, based on the total volume of the composite material. In another variation, the composite material comprises graphene particles in an amount from about 1% by volume to about 60% by volume, from about 1% by volume to about 40% by volume, about 1% by volume. volume at about 20% by volume, or about 1% by volume to about 10% by volume. In another variation, the matrix material comprises graphene particles in an amount of about 5% by volume to about 30% by volume or about 5% by volume to about 20% by volume. In another variation, the matrix material comprises graphene particles in an amount of about 5% by volume to about 10% by volume. In another variation, the matrix material comprises graphene particles in an amount from about 1% by volume to about 5% by volume. In addition, in some cases, the amount of grapheme dispersed in a matrix described herein is selected based on the thermal conductivity of the matrix and / or a desired thermal conductivity of the composite material. For example, in some cases, a greater amount of graphene is added to a matrix material having a lower thermal conductivity. In particular, in certain implementations comprising a nonconductive or minimally conductive matrix material, such as polymeric matrix materials described herein, graphene particles are dispersed in the matrix in an amount greater than the percolation limit. Also, in other cases, a lower amount of graphene may be added to a matrix material having a higher thermal conductivity. In addition, in some implementations, the size, shape and percentage by volume of graphene particles in a matrix described herein are selected to have minimal impact on the mechanical properties and / or processing capacity of the matrix material. . For example, in some cases, graphene platelets having a thickness up to about 10 nm, a width up to about 100 mm and a length up to about 1 cm are used in an amount up to about 20% by weight. volume. In such cases, the tensile strength and / or tensile modulus of the matrix material are altered by less than about 20%, less than about 15%, less than about 10% or less than about 5% by the inclusion of graphene platelets, based on the tensile strength and / or tensile modulus of the matrix material without a graphene wafer. The tensile strength and / or tensile modulus of a matrix material or composite material may be measured in any manner consistent with the objects of the present invention. In some cases, tensile strength and / or tensile modulus are measured by ASTM D3552 or ASTM E8. In some implementations, the impact of Charpy and / or the ductile to brittle transition temperature (DBTT) of the matrix material is altered by less than about 15%, less than about 10%, less than about 5% or less than about 1% by the inclusion of graphene platelets, based on the impact of Charpy and / or DBTT of the matrix material without a graphene wafer. The impact of Charpy and / or DBTT of a matrix or composite material can be measured in any manner consistent with the objectives of the present invention. In some cases, the impact of Charpy and / or DBTT is measured by a four-point bend test at a temperature range or in accordance with ASTM A370 and / or ASTM E23.
    [0010] A composite material described herein may be manufactured in any manner consistent with the objects of the present invention, including the following exemplary processes. In one process, graphene particles, such as graphene platelets, are provided in a dry form or in a dispersed form in a solvent. If provided in a solvent, the graphene particles may be dispersed in a solvent having a low boiling point such as, for example, acetone, alcohol or a similar solvent. The graphene particles are then introduced into a metal mesh or thin polymer or other porous network, including a mesh or isotropic network or random orientation. The graphene particles are captured on or within the mesh or lattice, and the solvent is removed by heating to form the composite material. In one variation, the mesh or network is formed of a metal such as aluminum, an aluminum alloy, copper, a copper alloy, titanium, a titanium alloy, stainless steel, brass or a combination thereof. If desired, the process may be repeated with several layers stacked to form a composite building block. According to a variation, the composite block can be further worked hot and / or cold to achieve a desired thickness and a desired density. The shaping can then be performed by any method to achieve a desired shape. In another variation, the graphene-containing composite material may be formed by melting and / or hot-extruding a graphene / matrix mixture. In another variation, a graphene-containing composite material is formed by forming layers of graphene in a loose bond thin sheet with a hot melt or electroless plating / electrolysis metal matrix to form a composite building block. . The composite building blocks can then be processed as described above, if desired. For example, the composite building blocks can be stacked, hot pressed, cold formed and / or machined / shaped. In another embodiment, graphene-containing composites can be formed using random orientation graphene sheets and conventional metallurgical powder processing. In addition, graphene-containing composites can be formed by an additive manufacturing process, such as direct metal laser sintering. In some implementations of a conduction cooled module described herein, the component shell defined by the first and second support structures may have a height between about 0.05 inches and about 2.5 inches. In some other implementations, the component shell may have a height of between about 0.1 inches to about 2.0 inches or about 0.2 inches to about 1.5 inches. In some implementations, the first and / or second external support structures may have a total width of between about 7 inches and about 8 inches. In some implementations, the first and / or second external support structures may have a total width of between about 7.1 inches and about 7.8 inches or about 7.3 inches to about 7.6 inches. In some implementations of a conduction cooled module described herein, the first and / or second external support structures may have a total length of between about 8 inches and about 11 inches. In some other implementations, the first and / or second external support structures may have a total length of between about 8.5 inches and about 10.5 inches or about 9 inches to about 10 inches. In some implementations of a conduction cooled module described herein, the PWB may be a PWB or a printed circuit board (PCB). In some implementations, PWBs may be configured or designed to conform to certain standards or form factors. For example, in some implementations, the PWB conforms to the ARINC 600 series standards published by Aeronautical Radio, Incorporated, or is a PWB of size ARINC 600. In an implementation of a conduction cooled module described herein the PWB has a thickness between about 0.05 inches and about 0.25 inches. In another embodiment, the PWB may be from about 0.08 inches to about 0.17 inches or from about 0.9 inches to about 0.15 inches thick. In addition, in some implementations, the PWB may have a width between about 5 inches and about 9 inches. Alternatively, in some implementations, the PWB may have a width between about 6 inches and about 8 inches or between about 6.5 inches and about 8.5 inches. In addition, in some implementations, the PWB may be between about 8 inches and about 12 inches in length. Alternatively, in some implementations, the PWB may have a length of between about 9 inches and about 11 inches or about 9.5 inches to about 10.5 inches. In some implementations of a conduction cooled module described herein, thermal interface materials (TIMs) may be used between a PWB and an external support structure. TIMs are often used to fill microscopic voids and to reduce thermal resistances, thereby facilitating heat transfer between two objects or materials in contact with each other. Any TIM consistent with the objectives of the present invention may be used. TIMs may comprise or be formed of foam, malleable material or paste. For example, in some cases, a ceramic powder suspended in a liquid or gelatinous material may be used. In some implementations, the liquid or gelatinous material is silicone. In such implementations, the ceramic powder may comprise one or more of beryllium oxide, aluminum nitride, aluminum oxide, zinc oxide and / or silicon dioxide. In some other implementations, a metal based grease containing solid metal particles may be used. For example, silver or aluminum particles may be disposed in a silicone grease. In some implementations, TIMs may comprise, comprise, or consist essentially of diamond powder, carbon fibers, and / or graphene. In some embodiments, a conduction cooled module described herein may further comprise a connector shell engaging the first external support structure and the second external support structure at one end of the first and second external support structures. In some implementations, a conduction cooled module comprising a connector shell may be configured to engage an electrical backplane of a conduction cooling rack or other electrical and / or electronic assembly. In some implementations, the connector envelope is external to the first and second external support structures and may be configured to interface with an electrical backplane opposite which power and signals are received and transmitted. In such implementations, the connector shell places the PWB in electrical communication with the electrical backplane. Therefore, in some implementations, the electric backplane is disposed within a conduction cooling rack, or it may be a component of an electrical rack and / or cooling great. The connector envelope and its interconnectivity with certain other elements or components will be described and illustrated hereinafter with reference to the accompanying figures. In some implementations, the connector envelope has a length less than or equal to about the height of the module. In other implementations, the connector shell has a module width and depth of about 0.5 inches to about 1 inch. In some other implementations, the connector shell has a length that is between about 5 inches and about 10 inches. In other implementations, the connector shell has a length that is between about 6 inches and about 9 inches or about 6.5 inches to about 8 inches. In some implementations of a conduction cooled module described herein, the connector shell has a width between about 0.5 inches and about 3 inches. In some other implementations, the connector shell has a width of between about 0.75 inches and about 2 inches or about 1 inch to about 1.5 inches. In addition, in some implementations of a conduction cooled module described herein, the connector shell has a thickness between about 0.3 inches and about 1.5 inches. In some other implementations, the connector shell has a thickness between about 0.5 inches and about 1.3 inches or about 0.6 inches to about 1 inch.
    [0011] FIG. 1 illustrates a front view in cross section of a conduction cooled module according to an implementation described here. As illustrated in FIG. 1, a conduction-cooled module (100) includes first and second external support structures (110, 120), the second external support structure (120) facing away from the first external support structure (110).
    [0012] The first and second external support structures (110, 120) define a component shell (170), and are configured to contact a cold plate (140). The component envelope includes a first component envelope portion (171) and a second component envelope portion (172). A PWB (130) is retained in the component envelope (170) between the first and second external support structures (110, 120). In the implementation of FIG. 1, the first and second external support structures (110, 120) form continuous heat conduction paths between the PWB (130) and the cold plate (140). The direction arrows in Figure 1 illustrate continuous heat transfer pathways of the PWB (130) through the first and second outer support structures (110, 120) to the cold plate (140). In some implementations, the first and second external support structures (110, 120) form the main heat conduction pathways between the PWB (130) and the cold plate (140). As used herein, the term "main heat conduction pathway" refers to the pathway in which the majority of the heat conduction moves. The term "majority" refers to more than about 50 percent to about 100 percent or less of heat conduction. In some implementations, the proportion of heat conduction that travels through the first and second external support structures (110, 120) is between about 60 percent and about 90 percent. In alternative implementations, the proportion of heat conduction moving through the first and second external support structures (110, 120) is between about 65 percent and about 85 percent, or about 75 percent to about 75 percent. hundred and about 95 percent of the heat conduction. Figure 2 illustrates a cross-sectional front view of an implementation of a conduction cooled module (200) described herein. As illustrated in FIG. 2, the module (200) may further comprise a thermally conductive substrate (250) disposed between the first and second external support structures (210, 220) in the component shell (270). the component envelope comprising a first component envelope portion (271) and a second component envelope portion (272). In some implementations, the substrate (250) may be configured to contact at least one PWB (230A, 230B). In some implementations, as illustrated in FIG. 2, the thermally conductive substrate (250) may be configured to contact a first PWB (230A) on a first side of the substrate (250) and a second PWB (230B) on a second side of the substrate (250). In the implementation of FIG. 3, the conduction cooled module (300) includes first and second external support structures (310, 320) that are configured to retain at least one PWB (330A, 330B), wherein the PWBs (330A, 330B) comprise one or more electronic components (360A, 360B, 360C, 360D, 360E) extending in the first and second component envelope portions (371, 372) of the component envelope ( 370) above the surface of the PWBs (330A, 330B). Figure 4A illustrates a cross-sectional side view of an implementation of a conduction cooled module described herein. Fig. 4B illustrates a cross-sectional top view of the conduction cooled module of Fig. 4A along the line A-A. Fig. 4C illustrates a cross-sectional front view of the conduction cooled module of Fig. 4A along the line B-B. The conduction-cooled module of Figs. 4A (400A), 4B (400B) and 4C (400C) comprises first external support structures (410A, 410B, 410C) and second external support structures (420A, 420B, 420C). respectively facing away from each other and defining a component envelope (470B, 470C), the component envelope having first and second component envelope portions (471B, 471C, 472B, 472C ). In the implementation of FIGS. 4A, 4B, 4C, the first external support structures (410A, 410B, 410C) and the second external support structures (420A, 420B, 420C) are configured to be in contact with at least one cold plate (440C) and for retaining at least one printed circuit board (430A, 430B, 430C) in the component shell. Figs. 5A, 5B, 5C and 5D illustrate cross-sectional front views of various implementations of conduction-cooled modules (500A, 500B, 500C, 500D) described herein. In such implementations, the first external support structures (510A, 510B, 510C, 510D) and the second external support structures (520A, 520B, 520C, 520D) are opposite one another. the other and are configured to retain at least one PWB (530A, 530B, 530C, 530D), wherein the PWB (530A, 530B, 530C, 530D) divides the component shell (570A, 570B, 570C, 570D) in a first component envelope portion (571A, 571B, 571C, 571D) and a second component envelope portion (572A, 572B, 572C, 572D). In some implementations, as illustrated in FIGS. 5A and 5D, the first and second envelope portions may have substantially equal heights. In some other implementations, as illustrated in FIGS. 5B and 5C, the first and second envelope portions have substantially different heights. Figure 6 illustrates a cross-sectional front view of an implementation of a conduction cooled module (600) described herein. In the implementation of FIG. 6, first and second external support structures (610, 620) face each other opposite to each other and are configured to retain at least one PWB (630). The first and second external support structures (610, 620) of Fig. 6 further include more heat exchanger surfaces (673) extending in the first and second component shell portions (671, 672). of the component envelope (670).
    [0013] Figure 7 illustrates a cross-sectional side view of an implementation of a conduction cooled module described herein. The implementation of FIG. 7 comprises a first external support structure (not shown) and a second external support structure (720) facing away from each other and defining a component envelope. the first and second outer support structures being configured to retain at least one PWB (730). Extension clips illustrated in Figure 7 may be used to secure the conduction cooled module (700) to at least one cold plate (not shown). The implementation of FIG. 7 further comprises a connector shell (780) engaging the first external support structure (not shown) and the second external support structure (720) at an end of the first and second external structures (not shown, 720). As shown in FIGS. 8A, 8B and 8C, a conduction-cooled module (800A, 800B, 800C) described herein may include a variety of configurations for contact with at least one cold plate (840A, 840B, 840C). 843A, 843B, 843C). In some implementations, the first and second external support structures (not shown) of a conduction-cooled module (800A, 800B, 800C) may have a variety of shapes or configurations to provide contact with at least one plate cold (840A, 840B, 840C, 843A, 843B, 843C). For example, in the embodiment illustrated in FIG. 8A, the first and second external support structures (not shown) of the conduction cooled module (800A) are configured to contact at least one cold plate (840A, 843A). ) with an expansion slot interface. The conduction cooled module (800A) may be fixed and / or held in place by a housing interface (842A) and an extension clamp (841A). In another implementation, as shown in FIG. 8B, the first and second external support structures (not shown) of the conduction cooled module (800B) are configured to contact the cold plates (840B, 843B). ) with a corner interface. Alternatively, in the implementation of FIG. 8C, the first and second external support structures (not shown) of the conduction cooled module (800C) are configured to contact the cold plate (300) with an interface. in fork. As shown in FIG. 8C, the conduction cooled module (800C) can be fixed and / or held in place by a housing interface (842) and an extension clamp (841C). II. Conduction Cooling Rack In another aspect, conduction cooling racks are described herein. In some implementations, a conduction cooling rack includes a first cold plate surface and a second cold plate surface separated from each other and facing each other opposite to each other, thereby defining an interior rack volume between the first and second cold plate surfaces. As used herein, the term "oppositely facing" means that each of the first and second cold plate surfaces comprises first and second sides, the first side of each cold plate surface being configured to face an first side of the other plate surface. In some implementations, the conduction cooling rack further includes one or more conduction cooled modules disposed in the interior rack volume between the first and second cold plate surfaces in physical contact with the first and second plate surfaces. cold. A conduction cooled module of a conduction cooling rack described herein may include any conduction cooled module described above in Chapter I. In some implementations, the one or more conduction cooled modules comprises first and second outer support structures facing away from each other, thereby defining a component shell therebetween. In addition, in some implementations, the first and second outer support structures are configured to contact the first and second cold plate surfaces and retain at least one PWB in the component shell between the first and second cold plate surfaces. external support structures. Thus, in some implementations, conduction cooled modules installed between two cold plates may comprise or define an LRU shelf. In addition, it should be understood that a rack described here may include several shelves. Such shelves may also include structural reinforcements so as to optimize the overall weight. In another aspect, orientations are contemplated such that the longest dimension of an electrical connector is in the vertical plane, with cold plates located above and below LRU rows. Such orientation causes the interfacing of the longest dimension of the electrical backplane oriented horizontally and parallel to that of the cold plates and its second dimension the longest oriented vertically and perpendicularly to that of the cold plates. Such orientations minimize the risk of foreign bodies, such as dust particles, moisture, etc., falling into electrical components (eg, pins) and damaging them. Conducted cooled modules may be attached or attached in cooling racks by any means according to the present invention. For example, in some implementations, retention or "hold" mechanisms may be used to prevent movement of the conduction cooled modules relative to the cooling racks. Retention mechanisms may comprise, comprise, or consist of substantially hooks, buttons, clips, clips, pins, bolts, or sockets. Similarly, ejection mechanisms may be present in cooling racks described herein. Ejection mechanisms may be configured to facilitate the removal or replacement of conduction cooled modules. Any ejection mechanism according to the objectives of the present invention can be used. For example, in some implementations, an eject mechanism includes one or more hooks, buttons, handles, latches and / or springs. In some cases, ejection mechanisms may be used to release retention means and in some implementations ejection mechanisms may provide an initial removal force which displaces a cooled conduction module from a position. fully inserted into a cooling rack. Some examples of retention and ejection mechanisms are described in Appendix A of ARINC 628 Part 7 (2000). Figure 9 illustrates a conduction cooling rack according to an implementation described herein. As shown in FIG. 9, a conduction cooling rack (900) described herein includes first and second cold plate surfaces (910, 920) facing away from each other, forming an interior rack volume. One or more conduction cooled modules (930) are disposed in the interior rack volume. The conduction cooled module (930) includes first and second external support structures (not shown), the second external support structure (not shown) facing away from the first external support structure (not shown). The first and second external support structures (not shown) are configured to be in contact with a cold plate (not shown). A PWB (not shown) is retained in the component envelope between the first and second external support structures (not shown). Various implementations of the invention have been described in accordance with the various objects of the invention. It should be appreciated that these implementations are merely illustrative of the principles of the present invention. Many modifications and adaptations thereof will come to the mind of the skilled person without departing from the spirit and scope of the invention.
    权利要求:
    Claims (16)
    [0001]
    REVENDICATIONS1. A conduction cooled module (100) comprising: a first external support structure (110); a second external support structure (120) facing away from the first external support structure (110); and a component envelope (170) defined by the first external support structure (110) and the second external support structure (120) and located between the first external support structure and the second external support structure (110, 120) wherein the first external support structure and the second external support structure (110, 120) are configured to contact at least one cold plate (140) and to retain at least one printed circuit board (130) in the component envelope (170) between the first external support structure (110) and the second external support structure (120).
    [0002]
    The module of claim 1, wherein the first and second external support structures (110, 120) form continuous heat conduction paths between the printed circuit board (130) and the cold plate (140).
    [0003]
    The module of claim 1 or 2, wherein the first and second external support structures (110, 120) form the main heat conduction paths between the printed circuit board (130) and the cold plate (140). .
    [0004]
    The module of claim 1, wherein the printed circuit board (130) is an ARINC 600 printed circuit board.
    [0005]
    Module according to any one of claims 1 to 4, wherein the module (100) further comprises a thermally conductive substrate (250) disposed between the first external support structure (210) and the second external support structure ( 220), the substrate being configured to contact the at least one printed circuit board (230A, 230B).
    [0006]
    The module of claim 5, wherein the substrate (250) is configured to contact a first printed circuit board (230A) on a first side of the substrate and a second printed circuit board (230B) on a second side of the substrate (250) facing away from the first side of the substrate (250).
    [0007]
    The module of any of the preceding claims, wherein the at least one printed circuit board (330A, 330B) comprises one or more electronic components (360A, 360B, 360C, 360D, 360E) extending into the enclosure of components (371, 372) above the surface of the printed circuit board (330A, 330B).
    [0008]
    The module of any of the preceding claims, wherein the component shell has a height of between about 0.2 inches and about 1.5 inches.
    [0009]
    The module of any preceding claim, wherein the at least one printed circuit board divides the component envelope (270) into a first component envelope portion (271) and a second portion of the component envelope (271). component shell (272), the first and second component shell portions being of substantially equal heights or the first and second component shell portions being of substantially different heights.
    [0010]
    The module of claim 1, wherein the first external support structure (610) and / or the second external support structure (620) comprises one or more heat exchange surfaces (673) extending into the component shell (670).
    [0011]
    The module of claim 1, wherein the first outer support structure and / or the second outer support structure are made of a composite material comprising graphene particles dispersed in a matrix material.
    [0012]
    Module according to claim 1, wherein the first external support structure and / or the second external support structure comprise a material selected from the group consisting of aluminum, aluminum alloy, copper, alloy of copper, titanium, titanium alloy, stainless steel and combinations thereof.
    [0013]
    The module of any of the preceding claims, further comprising a connector shell (780) engaging the first external support structure (710) and the second external support structure (720) at one end thereof. first and second external support structures (710, 720).
    [0014]
    14. Module according to any one of the preceding claims, wherein the conduction-cooled module is an in-line replaceable unit. 15
    [0015]
    15. Module according to any one of the preceding claims, wherein the at least one cold plate is a portion of a rack.
    [0016]
    The module of any preceding claim, wherein the first external support structure and the second external support structure are configured to contact at least one cold plate in a configuration selected from the group consisting of a wedge housing interface, a fork interface and a clamping interface.
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    同族专利:
    公开号 | 公开日
    US10182515B2|2019-01-15|
    US20150319881A1|2015-11-05|
    FR3020741B1|2019-08-02|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    WO2001049092A1|1999-12-28|2001-07-05|Thales Avionics S.A.|Electronic module with high cooling power|
    US20080019102A1|2006-07-20|2008-01-24|Honeywell International Inc.|Device for increased thermal conductivity between a printed wiring assembly and a chassis|
    US20100053901A1|2008-08-27|2010-03-04|Honeywell International Inc.|Hybrid Chassis Cooling System|
    US20110205712A1|2010-02-18|2011-08-25|Airbus Operations |Electronic module and electronic assembly comprising such a module|
    US4849858A|1986-10-20|1989-07-18|Westinghouse Electric Corp.|Composite heat transfer means|
    US5195021A|1989-08-21|1993-03-16|Texas Instruments Incorporated|Constraining core for surface mount technology|
    US5754403A|1989-09-29|1998-05-19|Texas Instruments Incorporated|Constraining core for surface mount technology|
    US5949650A|1998-09-02|1999-09-07|Hughes Electronics Corporation|Composite heat sink/support structure|
    US6246582B1|1998-12-30|2001-06-12|Honeywell Inc.|Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module|
    US6421240B1|2001-04-30|2002-07-16|Hewlett-Packard Company|Cooling arrangement for high performance electronic components|
    US7071258B1|2002-10-21|2006-07-04|Nanotek Instruments, Inc.|Nano-scaled graphene plates|
    WO2006124212A2|2005-05-19|2006-11-23|Bae Systems Information And Electronic Systems Integration Inc.|High density card retention device|
    EP1989935A4|2006-02-16|2012-07-04|Cooligy Inc|Liquid cooling loops for server applications|
    US8693079B2|2008-01-31|2014-04-08|Ajjer, Llc|Sealants and conductive busbars for chromogenic devices|
    GB0802912D0|2008-02-15|2008-03-26|Carben Semicon Ltd|Thin-film transistor, carbon-based layer and method of production thereof|
    JP2009230505A|2008-03-24|2009-10-08|Fujitsu Ltd|Board unit and electronic apparatus|
    US8004841B2|2008-05-06|2011-08-23|International Business Machines Corporation|Method and apparatus of water cooling several parallel circuit cards each containing several chip packages|
    US20100327504A1|2009-06-28|2010-12-30|Charles Seidel|Clamp Assembly|
    US8263843B2|2009-11-06|2012-09-11|The Boeing Company|Graphene nanoplatelet metal matrix|
    CN102892277B|2011-07-20|2016-08-03|光宝电子有限公司|Circuit board arrangement and manufacture method thereof and there is the power supply unit of this circuit board arrangement|US11127509B2|2016-10-11|2021-09-21|Ultraconductive Copper Company Inc.|Graphene-copper composite structure and manufacturing method|
    US10828869B2|2017-08-30|2020-11-10|Ultra Conductive Copper Company, Inc.|Graphene-copper structure and manufacturing method|
    US10427439B2|2017-09-11|2019-10-01|Apple Inc.|Substrate marking for sealing surfaces|
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    优先权:
    申请号 | 申请日 | 专利标题
    US14/268,006|US10182515B2|2014-05-02|2014-05-02|Conduction cooled module|
    US14/268006|2014-05-02|
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